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Published in 2025 at "IEEE Journal on Emerging and Selected Topics in Circuits and Systems"
DOI: 10.1109/jetcas.2025.3591677
Abstract: We propose a novel technology called Bumpless Build Cube (BBCubeTM) 3D for AI and high-performance computing (HPC) applications that require high bandwidth and power efficiency. BBCube 3D is constructed through heterogeneous 3D integration, in which…
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Keywords:
build cube;
cube;
heterogeneous integration;
power ... See more keywords