Investigation of Sn–3.0Ag–0.5Cu Bump Arrays Prepared by the Pulsated Orifice Ejection Method
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DOI: 10.1002/adem.202402605
Abstract: By targeting advances in electronic packaging technologies, an innovative strategy has been applied for fabricating bump arrays. Herein, a 3D motion platform is equipped with pulsated orifice ejection method for direct bump deposition. This method… read more here.
Keywords: bump; method; pulsated orifice; bump arrays ... See more keywords