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Published in 2017 at "Journal of Instrumentation"
DOI: 10.1088/1748-0221/12/01/c01084
Abstract: We have developed flip-chip modules applicable to the pixel detector for the HL-LHC. New radiation-tolerant n+-in-p planar pixel sensors of a size of four FE-I4 application-specific integrated circuits (ASICs) are laid out in a 6-in…
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Keywords:
flip;
bump bonding;
quadsensor;
pixel ... See more keywords