A Fast Method to Estimate Through-Bump Current for Power Delivery Verification
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DOI: 10.1109/tcad.2022.3203957
Abstract: Due to the mismatch between the package scaling and the relentless silicon technology scaling, the limited power supply bumps have to bear more stresses on bump reliability. A too high through-bump (TB) current may induce… read more here.
Keywords: bump current; methodology; power; delivery verification ... See more keywords