Investigation of the interfacial reactions between Sn-3.0 wt%Ag-0.5 wt%Cu solder and Cu Ti alloy (C1990HP)
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DOI: 10.1016/j.microrel.2019.03.006
Abstract: Abstract The interfacial reactions between Sn-3.0 wt%Ag-0.5 wt%Cu (SAC) solder and Cu Ti alloy (C1990HP) using the solid/liquid reaction couple technique reflowed at 240, 255, and 270 °C for 10 min to 20 h was first investigated. The… read more here.
Keywords: cu6sn5 phase; c1990hp; reaction; interfacial reactions ... See more keywords