Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging
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DOI: 10.1109/tcpmt.2020.2986714
Abstract: Thermomechanical modeling of a new double-overmolded optical sensor package, comprising a highly filled, as well as an unfilled, strongly thermally expanding transfer molding compound, is presented. Materials’ characterization of the polymers using thermal, thermomechanical, dynamic,… read more here.
Keywords: fields double; validation optimization; calculated stress; package ... See more keywords