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Published in 2019 at "ACS applied materials & interfaces"
DOI: 10.1021/acsami.9b17358
Abstract: Liquid metal (LM) based thermal interface materials (TIMs) have the potential to dissipate the high heat loads in modern electronics and often consist of LM microcapsules embedded in a polymer matrix. The shells of these…
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Keywords:
oxide shell;
liquid metal;
capsule beds;
rupture ... See more keywords