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Published in 2024 at "Advanced Functional Materials"
DOI: 10.1002/adfm.202414194
Abstract: The rapid advancement of Internet of Things (IoT) technology and AI microchips has increased the demand for efficient and cost‐effective cooling solutions. However, traditional Bi2Te3‐based thermoelectric modules face the challenge of low abundance tellurium (Te).…
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Keywords:
refrigeration;
carbon modulated;
amorphous carbon;
cdsb ... See more keywords