Interfacial Microstructure and Its Influence on Resistivity of Thin Layers Copper Cladding Steel Wires
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DOI: 10.1134/s0031918x18040105
Abstract: The interfacial microstructure and resistivity of cold-drawn and annealed thin layers copper cladding steel (CCS) wires have been systematically investigated by the methods of scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive spectroscopy… read more here.
Keywords: resistivity; ccs wires; interfacial microstructure; microscopy ... See more keywords