On the Control of Plasma Parameters and Active Species Kinetics in CF4 + O2 + Ar Gas Mixture by CF4/O2 and O2/Ar Mixing Ratios
Sign Up to like & getrecommendations! Published in 2017 at "Plasma Chemistry and Plasma Processing"
DOI: 10.1007/s11090-017-9820-z
Abstract: The effects of both CF4/O2 and Ar/O2 mixing ratios in three-component CF4 + O2 + Ar mixture on plasma parameters, densities and fluxes of active species determining the dry etching kinetics were analyzed. The investigation combined plasma diagnostics by… read more here.
Keywords: plasma; cf4; gas; mixing ratios ... See more keywords
Decomposition of tetrafluoromethane by reaction with CaO-enhanced zeolite
Sign Up to like & getrecommendations! Published in 2020 at "Journal of environmental chemical engineering"
DOI: 10.1016/j.jece.2020.103763
Abstract: Abstract Tetrafluoromethane (CF4), the most stable perfluorocarbon, has a high global warming potential and high chemical stability. Various methods, including rotary kiln processing, plasma decomposition, and catalysts, are used to decompose CF4 before discharge to… read more here.
Keywords: cf4; reaction cao; tetrafluoromethane; reaction ... See more keywords
CF4 adsorption on porous carbon derived from silicon carbide
Sign Up to like & getrecommendations! Published in 2020 at "Microporous and Mesoporous Materials"
DOI: 10.1016/j.micromeso.2020.110373
Abstract: Abstract Considering the increasing industrial demand for CF4 and its high global warming potential, appropriate disposal methods for CF4 are required. Adsorption can not only be used for CF4 capture but is also promising for… read more here.
Keywords: adsorption; silicon carbide; cf4; cf4 adsorption ... See more keywords
Etching characteristics of Si using surface discharge plasma under Ar/CF4 and He/CF4 conditions
Sign Up to like & getrecommendations! Published in 2017 at "Materials Science in Semiconductor Processing"
DOI: 10.1016/j.mssp.2017.04.028
Abstract: Abstract A maskless etching technique that is useful for manufacturing solar cells and microelectronics was examined using surface discharge plasma operated at atmospheric pressure. In this study, in order to investigate the obvious etching characteristics… read more here.
Keywords: discharge plasma; cf4; surface discharge; using surface ... See more keywords
CF4 Capture and Separation of CF4–SF6 and CF4–N2 Fluid Mixtures Using Selected Carbon Nanoporous Materials and Metal–Organic Frameworks: A Computational Study
Sign Up to like & getrecommendations! Published in 2022 at "ACS Omega"
DOI: 10.1021/acsomega.1c06167
Abstract: The adsorption of pure fluid carbon tetrafluoride and the separation of CF4–SF6 and CF4–N2 fluid mixtures using representative nanoporous materials have been investigated by employing Monte Carlo and molecular dynamics simulation techniques. The selected materials… read more here.
Keywords: cf4; carbon; nanoporous materials; sf6 ... See more keywords
Unraveling the Mechanism of Maskless Nanopatterning of Black Silicon by CF4/H2 Plasma Reactive-Ion Etching
Sign Up to like & getrecommendations! Published in 2022 at "ACS Omega"
DOI: 10.1021/acsomega.2c02740
Abstract: The process of deep texturization of the crystalline silicon surface is intimately related to its promising diverse applications, such as bactericidal surfaces for integrated lab-on-chip devices and absorptive optical layers (black silicon—BSi). Surface structuring by… read more here.
Keywords: cf4; surface; plasma; silicon ... See more keywords
Discharge characteristics of electronegative Mg–CF4 direct current magnetron sputtering by probe measurements
Sign Up to like & getrecommendations! Published in 2021 at "Journal of Applied Physics"
DOI: 10.1063/5.0052871
Abstract: The discharge characteristics of Mg–CF4 direct current (DC) reactive magnetron sputtering, which is assumed to be a typical electronegative discharge, are investigated as a function of CF4/(Ar + CF4) discharge gas ratios using probe measurements. For comparison,… read more here.
Keywords: cf4 cf4; magnetron sputtering; cf4; probe ... See more keywords
Effects of CF4 content on particle densities and reaction pathways in atmospheric-pressure Ar/CF4 pulsed dielectric barrier discharge plasma
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Physics D: Applied Physics"
DOI: 10.1088/1361-6463/aac3e7
Abstract: Ar/CF4 discharge plasma etching is a promising approach to achieving a high etch rate and anisotropic etching. A 1D fluid model is established to numerically study the effects of CF4 content on particle densities and… read more here.
Keywords: cf4; discharge plasma; reaction pathways; cf3 ... See more keywords
Study on the properties of zinc oxide films with different CF4 flow rates
Sign Up to like & getrecommendations! Published in 2021 at "Modern Physics Letters B"
DOI: 10.1142/s0217984921502043
Abstract: In this research, we will show that as the flow rates of CF4 (CF4/(Ar + CF4)) are different, the optical, crystal, and electrical properties of FZO films have large variations. At first, ZnO target... read more here.
Keywords: flow rates; cf4; study properties; flow ... See more keywords
The Design of Sulfated Ce/HZSM-5 for Catalytic Decomposition of CF4
Sign Up to like & getrecommendations! Published in 2022 at "Polymers"
DOI: 10.3390/polym14132717
Abstract: CF4 has a global warming potential of 6500 and possesses a lifetime of 50,000 years. In this study, we modified the HZSM-5 catalyst with Ce and sulfuric acid treatment. The S/Ce/HZSM-5 catalyst achieves 41% of… read more here.
Keywords: cf4; cf4 decomposition; sulfated hzsm; decomposition ... See more keywords