Effects of CF4 content on particle densities and reaction pathways in atmospheric-pressure Ar/CF4 pulsed dielectric barrier discharge plasma
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DOI: 10.1088/1361-6463/aac3e7
Abstract: Ar/CF4 discharge plasma etching is a promising approach to achieving a high etch rate and anisotropic etching. A 1D fluid model is established to numerically study the effects of CF4 content on particle densities and… read more here.
Keywords: cf4; discharge plasma; reaction pathways; cf3 ... See more keywords