Integration Challenges on 300-mm High Resistivity Silicon Substrates
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DOI: 10.1109/tsm.2025.3567206
Abstract: A review of 300mm high-resistivity Czochralski silicon (Cz-Si) wafers after optimized thermal treatments, is presented. The challenge of resistivity monitoring due to the thermal donors phenomenon is highlighted. A new protocol based on the combination… read more here.
Keywords: challenges 300; resistivity; high resistivity; silicon ... See more keywords