A Micro-Channel Cooling Model for a Three-Dimensional Integrated Circuit Considering Through-Silicon Vias
Sign Up to like & getrecommendations! Published in 2020 at "Micro and Nanosystems"
DOI: 10.2174/1876402912666200123154001
Abstract: With the increase in the integration degree of the three-dimensional Integrated Circuit ( 3D I C) , the thermal power consumption per unit volume increases greatly, which makes the chip temperature rise. High temperature could… read more here.
Keywords: three dimensional; channel cooling; integrated circuit; dimensional integrated ... See more keywords