3D Sidewall Integration of Ultrahigh‐Density Silicon Nanowires for Stacked Channel Electronics
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DOI: 10.1002/aelm.201800627
Abstract: Building 3D electronics represents a promising method for the integration of more functionalities into a given footprint. To this end, stacked multilevel silicon nanowires (SiNWs) are ideal multilevel channels to construct high‐density 3D electronics. 3D… read more here.
Keywords: integration; density; channel electronics; stacked channel ... See more keywords