Characterization of Electroless Nickel Plated Materials During High Temperature Solder Processing
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DOI: 10.1109/tsm.2019.2945517
Abstract: Electroless nickel immersion gold (ENIG) has emerged as a leading surface finish for under bump metallization (UBM). An ENIG surface typically exhibits excellent planarity, good electrical characteristics, wettability for solder, and wire bond-ability. Reliability and… read more here.
Keywords: plated materials; electroless; solder; electroless nickel ... See more keywords