Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys
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DOI: 10.1016/j.matchar.2020.110445
Abstract: Abstract Sn-Bi-based Thermal Interface Materials (TIM) are adequate alloys to promote heat dissipation in power electronics. However, despite the necessary thermal connection, mechanical support for different components and substrates are of prime importance in microelectronic… read more here.
Keywords: tensile properties; characterization tensile; microstructure characterization; microscopy ... See more keywords