Metal-Embedded Chip Assembly Processing for Enhanced RF Circuit Performance
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DOI: 10.1109/tmtt.2019.2931010
Abstract: This paper presents the radio frequency (RF) benefits of a heterogeneous integration technique for multi-chip modules. Passive components, such as lumped metal–insulator–semiconductor (MIS) and ceramic capacitors, as well as coupler circuits implemented on alumina substrates,… read more here.
Keywords: chip assembly; metal embedded; embedded chip; chip ... See more keywords