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Published in 2017 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2017.2684092
Abstract: Assembly of silicon onto FR4-based organic substrates using flip-chip process continues to pose substantial thermomechanical challenges largely due to the disparate coefficients of thermal expansion (CTEs) of silicon and substrate. In flip-chip packaging, this CTE…
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Keywords:
chip attach;
pressure compensated;
process;
compensated chip ... See more keywords