Thermal Study for High-Photocurrent Photodetector in Non-Saturation Region Using Thin Substrate, Thin Absorber, and Flip- Chip Bonding Process
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Access"
DOI: 10.1109/access.2024.3391336
Abstract: We reported a thermal investigation on a photodetector (PD) with a sandwiched structure comprising p-type, intrinsic, and n-type (PIN-PD) layers based on Williams’ thermal model. Simulations and measurements of the photocurrent in the linear region,… read more here.
Keywords: inline formula; flip chip; tex math; chip bonding ... See more keywords
Flip-Chip Bonding Using Aerosol Jet Printed Silver Nanoparticles for RF Applications
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2025.3599451
Abstract: This work demonstrates a new approach to flip-chip bonding of RF chips using aerosol jet printed silver nanoparticle (NP) microbumps for advanced packaging and heterogeneous integration. Here, chips with gold pads are flip-chip mounted on… read more here.
Keywords: aerosol jet; flip chip; chip bonding; using aerosol ... See more keywords