Low Loss Chip‐to‐Chip Couplers for High‐Density Co‐Packaged Optics
Sign Up to like & getrecommendations! Published in 2024 at "Advanced Engineering Materials"
DOI: 10.1002/adem.202402095
Abstract: An experimentally demonstrated, vertical chip‐to‐chip evanescent coupler between silicon nitride (SiN x$_{x}$ ) and silicon (Si) is presented with the coupler loss measured to be 0.39 ±$\pm$ 1.06 dB at 1550 nm with a 1‐dB bandwidth of… read more here.
Keywords: loss; chip chip; tolerance; optics ... See more keywords
ChIP and ChIP-Related Techniques: Expanding the Fields of Application and Improving ChIP Performance.
Sign Up to like & getrecommendations! Published in 2018 at "Methods in molecular biology"
DOI: 10.1007/978-1-4939-7380-4_1
Abstract: Protein-DNA interactions in vivo can be detected and quantified by chromatin immunoprecipitation (ChIP). ChIP has been instrumental for the advancement of epigenetics and has set the groundwork for the development of a number of ChIP-related… read more here.
Keywords: related techniques; chip performance; chip chip; chip related ... See more keywords
Wear and mechanical properties of Al chips and Al chips composites recycled by high-pressure torsion
Sign Up to like & getrecommendations! Published in 2021 at "Journal of materials research and technology"
DOI: 10.1016/j.jmrt.2021.06.064
Abstract: Abstract Pure Al chip, Al chip-20% Al2O3, and Al chip-20% SiC samples were recycled using high-pressure torsion (HPT). Influence of the HPT processing on the feasibility of the consolidation, the microstructure evolution, the hardness, and… read more here.
Keywords: high pressure; pressure torsion; chip; hpt processing ... See more keywords
Vertical GaN MISFET for chip‐on‐chip high speed laser driving applications
Sign Up to like & getrecommendations! Published in 2020 at "Electronics Letters"
DOI: 10.1049/el.2020.0896
Abstract: In this work, the authors developed vertical gallium nitride metal-insulator-semiconductor field-effect transistors (GaN MISFETs) for direct chip-on-chip assembly with gallium arsenide-based broad area distributed Bragg reflector diode laser. The intention of this work had been… read more here.
Keywords: chip chip; gan misfet; chip; vertical gan ... See more keywords
Switched Beam SIW Horn Arrays at 60 GHz for 360° Reconfigurable Chip-to-Chip Communications With Interference Considerations
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Access"
DOI: 10.1109/access.2021.3097036
Abstract: Traditional wired interconnects in multicore multichip (MCMC) systems can be replaced with chip-integrated switched beam antenna arrays to provide reconfigurable chip-to-chip communications. By simply switching the directive beams of the arrays, the chips can be… read more here.
Keywords: reconfigurable chip; chip communications; interference; chip ... See more keywords
Hardware/Software Implementation of a Chip-to-Chip Communication Protocol Based on SPDM
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Access"
DOI: 10.1109/access.2024.3519385
Abstract: Zero-Trust security has received significant attention because of its focus on the need to constantly verify rather than trust, especially as attackers use increasingly sophisticated methods. It is now critical to ensure the security and… read more here.
Keywords: zero trust; hardware; chip chip; chip ... See more keywords
Compact Low-Loss Chip-to-Waveguide and Chip-to-Chip Packaging Concept Using EBG Structures
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Microwave and Wireless Components Letters"
DOI: 10.1109/lmwc.2020.3034772
Abstract: This letter presents a novel approach for packaging millimeter-wave (mmW) and terahertz (THz) circuits. The proposed technique relies on using an on-chip coupling structure that couples the signal to a quarter-wavelength cavity, which in turn… read more here.
Keywords: low loss; packaging; compact low; chip ... See more keywords
A 0.0375-pJ/bit Charge-Steering Based Hybrid for 8-Gb/s/pin Full-Duplex Chip-to-Chip Interconnects in 65-nm CMOS
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Circuits and Systems I: Regular Papers"
DOI: 10.1109/tcsi.2024.3469395
Abstract: This paper presents an energy-efficient, half-rate charge-steering logic (HR-CSL) based echo cancellation hybrid (ECH) circuit topology for full-duplex(FD) signaling across chip-to-chip interconnects. The proposed charge-steering logic (CSL) based hybrid has much lower power consumption compared… read more here.
Keywords: chip chip; charge steering; logic; based hybrid ... See more keywords
Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3-D Concept
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Industry Applications"
DOI: 10.1109/tia.2016.2604379
Abstract: With the emergence of new power semiconductor devices, the switching speeds in power converters are increasing. The stray inductances of switching cells must, therefore, be minimized to limit overvoltages on transistors. One relatively new approach,… read more here.
Keywords: module; implementation switching; power; chip chip ... See more keywords