Sign Up to like & get
recommendations!
1
Published in 2018 at "Methods in molecular biology"
DOI: 10.1007/978-1-4939-7380-4_1
Abstract: Protein-DNA interactions in vivo can be detected and quantified by chromatin immunoprecipitation (ChIP). ChIP has been instrumental for the advancement of epigenetics and has set the groundwork for the development of a number of ChIP-related…
read more here.
Keywords:
related techniques;
chip performance;
chip chip;
chip related ... See more keywords
Sign Up to like & get
recommendations!
1
Published in 2021 at "Journal of materials research and technology"
DOI: 10.1016/j.jmrt.2021.06.064
Abstract: Abstract Pure Al chip, Al chip-20% Al2O3, and Al chip-20% SiC samples were recycled using high-pressure torsion (HPT). Influence of the HPT processing on the feasibility of the consolidation, the microstructure evolution, the hardness, and…
read more here.
Keywords:
high pressure;
pressure torsion;
chip;
hpt processing ... See more keywords
Sign Up to like & get
recommendations!
1
Published in 2020 at "Electronics Letters"
DOI: 10.1049/el.2020.0896
Abstract: In this work, the authors developed vertical gallium nitride metal-insulator-semiconductor field-effect transistors (GaN MISFETs) for direct chip-on-chip assembly with gallium arsenide-based broad area distributed Bragg reflector diode laser. The intention of this work had been…
read more here.
Keywords:
chip chip;
gan misfet;
chip;
vertical gan ... See more keywords
Sign Up to like & get
recommendations!
2
Published in 2021 at "IEEE Access"
DOI: 10.1109/access.2021.3097036
Abstract: Traditional wired interconnects in multicore multichip (MCMC) systems can be replaced with chip-integrated switched beam antenna arrays to provide reconfigurable chip-to-chip communications. By simply switching the directive beams of the arrays, the chips can be…
read more here.
Keywords:
reconfigurable chip;
chip communications;
interference;
chip ... See more keywords
Sign Up to like & get
recommendations!
2
Published in 2021 at "IEEE Microwave and Wireless Components Letters"
DOI: 10.1109/lmwc.2020.3034772
Abstract: This letter presents a novel approach for packaging millimeter-wave (mmW) and terahertz (THz) circuits. The proposed technique relies on using an on-chip coupling structure that couples the signal to a quarter-wavelength cavity, which in turn…
read more here.
Keywords:
low loss;
packaging;
compact low;
chip ... See more keywords
Sign Up to like & get
recommendations!
1
Published in 2017 at "IEEE Transactions on Industry Applications"
DOI: 10.1109/tia.2016.2604379
Abstract: With the emergence of new power semiconductor devices, the switching speeds in power converters are increasing. The stray inductances of switching cells must, therefore, be minimized to limit overvoltages on transistors. One relatively new approach,…
read more here.
Keywords:
module;
implementation switching;
power;
chip chip ... See more keywords