Articles with "chip integration" as a keyword



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Graphene Oxide for Integrated Photonics and Flat Optics.

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Published in 2020 at "Advanced materials"

DOI: 10.1002/adma.202006415

Abstract: With superior optical properties, high flexibility in engineering its material properties, and strong capability for large-scale on-chip integration, graphene oxide (GO) is an attractive solution for on-chip integration of 2D materials to implement functional integrated… read more here.

Keywords: graphene oxide; chip integration; integrated photonic; optics ... See more keywords
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Fabrication Technologies for the On‐Chip Integration of 2D Materials

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Published in 2022 at "Small Methods"

DOI: 10.1002/smtd.202101435

Abstract: With compact footprint, low energy consumption, high scalability, and mass producibility, chip‐scale integrated devices are an indispensable part of modern technological change and development. Recent advances in 2D layered materials with their unique structures and… read more here.

Keywords: integration materials; fabrication technologies; chip integration; chip ... See more keywords
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High frequency acoustic on-chip integration for particle characterization and manipulation in microfluidics

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Published in 2017 at "Applied Physics Letters"

DOI: 10.1063/1.5003414

Abstract: This letter presents a microfluidic device that integrates high frequency (650 MHz) bulk acoustic waves for the realization of particle handling on-chip. The core structure of the microfluidic chip is made up of a confocal lens,… read more here.

Keywords: high frequency; chip integration; particle; manipulation ... See more keywords
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Bonding methods for chip integration with Parylene devices

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Published in 2021 at "Journal of Micromechanics and Microengineering"

DOI: 10.1088/1361-6439/abe246

Abstract: Flexible electronics require more compact interconnects for next-generation devices. Polymer devices can be bonded to integrated circuit chips, but combining flexible and rigid substrates poses unique technical challenges. Existing technologies either cannot achieve the density… read more here.

Keywords: methods chip; chip integration; bonding methods; integration parylene ... See more keywords
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Flip-Chip Integration of InP and SiN

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Published in 2019 at "IEEE Photonics Technology Letters"

DOI: 10.1109/lpt.2019.2892851

Abstract: We present an interface for hybrid flip-chip integration of InP-based laser sources to silicon-nitride-based photonic platforms. The design enables efficient high optical power coupling over a wide temperature range. The optical modes of laser and… read more here.

Keywords: chip integration; flip chip; integration; integration inp ... See more keywords
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Hybrid silicon photonics DBR laser based on flip-chip integration of GaSb amplifiers and µm-scale SOI waveguides.

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Published in 2022 at "Optics express"

DOI: 10.1364/oe.460883

Abstract: The development of integrated photonics experiences an unprecedented growth dynamic, owing to accelerated penetration to new applications. This leads to new requirements in terms of functionality, with the most obvious feature being the increased need… read more here.

Keywords: flip chip; photonics; chip integration; integration gasb ... See more keywords
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Optofluidic Formaldehyde Sensing: Towards On-Chip Integration

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Published in 2020 at "Micromachines"

DOI: 10.3390/mi11070673

Abstract: Formaldehyde (HCHO), a chemical compound used in the fabrication process of a broad range of household products, is present indoors as an airborne pollutant due to its high volatility caused by its low boiling point… read more here.

Keywords: chip integration; towards chip; formaldehyde; silicon ... See more keywords