High-Efficiency Revolving-Turret Chip Transferring Technology for Flip Chip Packaging
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2017.2760342
Abstract: With the rapid growth of the microelectronic packaging market, it is necessary to increase the throughput and reduce the cost of flip chip. Driven by these evolutions, a novel revolving-turret chip transferring (RTCT) technology is… read more here.
Keywords: flip chip; chip packaging; technology; packaging ... See more keywords
SiO2-coated Cu nanoparticle/epoxy resin composite and its application in the chip packaging field
Sign Up to like & getrecommendations! Published in 2019 at "High Performance Polymers"
DOI: 10.1177/0954008318781697
Abstract: A silicon dioxide–copper (SiO2-Cu) epoxy resin composite material for chip packaging was made by a mechanical mixing method with epoxy resin as the base glue and SiO2 coated with nano-Cu (SiO2-Cu) particles as the filler.… read more here.
Keywords: epoxy resin; chip packaging; sio2; microscopy ... See more keywords