An On‐Chip SiC MEMS Device with Integrated Heating, Sensing, and Microfluidic Cooling Systems
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DOI: 10.1002/admi.201800764
Abstract: There has been increasing interest in electronic systems with integrated microfluidic active cooling modules. However, the failure of 3C‐SiC/Si interface with increasing temperature has prevented the development of 3C‐SiC power electronic devices. Here, all integrated… read more here.
Keywords: system; heating sensing; cooling systems; thermal management ... See more keywords