Direct Chip-to-Waveguide Transition Realized With Wire Bonding for 140–220 GHz G-Band
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DOI: 10.1109/tthz.2020.2971690
Abstract: This work presents a method to realize a direct chip-to-waveguide transition by means of commercial wire-bonding tools. A straight E-field probe is formed by a freely suspended bondwire and mounted to a standard RF pad… read more here.
Keywords: chip waveguide; waveguide transition; direct chip; wire bonding ... See more keywords