On Hardware Security and Trust for Chiplet-Based 2.5D and 3D ICs: Challenges and Innovations
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Access"
DOI: 10.1109/access.2024.3368152
Abstract: The relentless pace of transistor miniaturization has enabled developers to continuously increase chip complexity since the beginning of the information age. However, as transistors get smaller and chips become larger, the cost of manufacturing ICs… read more here.
Keywords: chiplet based; security trust; chiplet; industry ... See more keywords
BUP: A Deadlock Resolution Framework for 2.5D Chiplet Networks by Update Packet Bypassing
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Journal on Emerging and Selected Topics in Circuits and Systems"
DOI: 10.1109/jetcas.2025.3590870
Abstract: Interposer-based 2.5D integration, as a promising packaging technology, is extensively applied in chiplet-based systems. However, even if both the interposer and chiplets are deadlock-free, new deadlocks may still occur across them after integration. To address… read more here.
Keywords: deadlock resolution; resolution framework; chiplet; update packet ... See more keywords
A Standardized 20-Tb/s Bandwidth Scalable Heterogeneous 2.5-D System Supporting Assembly Time Workload-Dependent Chiplet Configurations
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Journal of Solid-State Circuits"
DOI: 10.1109/jssc.2025.3613339
Abstract: The increasing adoption of chiplet-based architectures highlights the compelling paradigm of disaggregating monolithic systems into interconnected chiplets, offering numerous advantages for heterogeneous integration. This disaggregation is essential as chips approach the reticle limit, improving yield… read more here.
Keywords: system; bandwidth scalable; chiplet; standardized bandwidth ... See more keywords
On Optimizing Inter- and Intra-Chiplet Interconnection Topologies for Robust Multi-Chiplet Systems
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"
DOI: 10.1109/tcad.2025.3550432
Abstract: Inter- and intra-chiplet interconnection networks play a vital role in the operation of many core systems made of multiple chiplets. However, these networks are susceptible to faults caused by manufacturing defects and attacks resulting from… read more here.
Keywords: intra chiplet; chiplet interconnection; chiplet; inter intra ... See more keywords
Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2024.3363652
Abstract: With the continuous growth of disaggregated systems, a need for new modular platforms to facilitate integration arises. A rePlaceable INegrated CHiplet (PINCH) assembly technology with the capability for reassembly, upgradeability, testing, and prototyping systems of… read more here.
Keywords: tex math; chiplet; inline formula;
Trade-Off-Oriented Impedance Optimization of Chiplet-Based 2.5-D Integrated Circuits With a Hybrid MDP Algorithm for Noise Elimination
Sign Up to like & getrecommendations! Published in 2022 at "IEEE Transactions on Circuits and Systems I: Regular Papers"
DOI: 10.1109/tcsi.2022.3200410
Abstract: Interposer and chiplet-based 2.5-D integrated circuit (IC) designs have become a new trend for block-level heterogeneous integration. In this paper, a new hybrid metaheuristic algorithm named Metropolis-based differential particle swarm optimization (MDP) is designed to… read more here.
Keywords: chiplet based; chiplet; based integrated; impedance ... See more keywords
FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Circuits and Systems I: Regular Papers"
DOI: 10.1109/tcsi.2024.3419579
Abstract: Silicon interposer re-usage is drawing attention for cost-effective multi-chiplet integrated systems. To address the communication awareness of inter/off-chiplet interconnect, the paper proposes a field-programmable interconnect fabric and develops its corresponding automatic physical integration tool. The… read more here.
Keywords: integration; field programmable; chiplet; silicon interposer ... See more keywords
Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Very Large Scale Integration (VLSI) Systems"
DOI: 10.1109/tvlsi.2020.3015494
Abstract: A new trend in system-on-chip (SoC) design is chiplet-based IP reuse using 2.5-D integration. Complete electronic systems can be created through the integration of chiplets on an interposer, rather than through a monolithic flow. This… read more here.
Keywords: interposer; integration; chip; package ... See more keywords
M2M: A Fine-Grained Mapping Framework to Accelerate Multiple DNNs on a Multi-Chiplet Architecture
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Very Large Scale Integration (VLSI) Systems"
DOI: 10.1109/tvlsi.2024.3438549
Abstract: With the advancement of artificial intelligence, the collaboration of multiple deep neural networks (DNNs) has been crucial to existing embedded systems and cloud systems, especially for automatic driving applications as well as augmented and virtual… read more here.
Keywords: grained mapping; fine grained; chiplet; multiple dnns ... See more keywords
Thermal Interaction and Cooling of Electronic Device with Chiplet 2.5D Integration
Sign Up to like & getrecommendations! Published in 2024 at "Applied Sciences"
DOI: 10.3390/app14188114
Abstract: With the development of artificial intelligence (AI) and high-performance computing (HPC), the microelectronic industry is challenged with increased device integration density. Chiplet architecture can break through a variety of limitations on the system-on-chip (SoC) to… read more here.
Keywords: integration; parameter model; device; thermal interaction ... See more keywords
Design of Spectrum Processing Chiplet Based on FFT Algorithm
Sign Up to like & getrecommendations! Published in 2023 at "Micromachines"
DOI: 10.3390/mi14020402
Abstract: With the rapid development of electronic information and computer science, the fast Fourier transform (FFT) has played an increasingly important role in digital signal processing (DSP). This paper presented a spectrum processing chiplet design method… read more here.
Keywords: chiplet; spectrum processing; processing chiplet; design ... See more keywords