Trade-Off-Oriented Impedance Optimization of Chiplet-Based 2.5-D Integrated Circuits With a Hybrid MDP Algorithm for Noise Elimination
Sign Up to like & getrecommendations! Published in 2022 at "IEEE Transactions on Circuits and Systems I: Regular Papers"
DOI: 10.1109/tcsi.2022.3200410
Abstract: Interposer and chiplet-based 2.5-D integrated circuit (IC) designs have become a new trend for block-level heterogeneous integration. In this paper, a new hybrid metaheuristic algorithm named Metropolis-based differential particle swarm optimization (MDP) is designed to… read more here.
Keywords: chiplet based; chiplet; based integrated; impedance ... See more keywords
Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Very Large Scale Integration (VLSI) Systems"
DOI: 10.1109/tvlsi.2020.3015494
Abstract: A new trend in system-on-chip (SoC) design is chiplet-based IP reuse using 2.5-D integration. Complete electronic systems can be created through the integration of chiplets on an interposer, rather than through a monolithic flow. This… read more here.
Keywords: interposer; integration; chip; package ... See more keywords
Design of Spectrum Processing Chiplet Based on FFT Algorithm
Sign Up to like & getrecommendations! Published in 2023 at "Micromachines"
DOI: 10.3390/mi14020402
Abstract: With the rapid development of electronic information and computer science, the fast Fourier transform (FFT) has played an increasingly important role in digital signal processing (DSP). This paper presented a spectrum processing chiplet design method… read more here.
Keywords: chiplet; spectrum processing; processing chiplet; design ... See more keywords