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Published in 2021 at "Composites Communications"
DOI: 10.1016/j.coco.2021.100744
Abstract: Abstract Due to the integrated development of electronic products, developing thermal management materials with excellent heat dissipation performance is still in challenging. In addition, in order to help the increasingly complex electronic devices to achieve…
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Keywords:
boron nitride;
circinate vane;
heat dissipation;
vane type ... See more keywords