Thermal modeling and analysis of three-dimensional integrated circuits with irregular structure
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DOI: 10.2298/tsci220805061r
Abstract: Considering the manufacturing and packaging process, three-dimensional integrated circuits design often requires irregular chip structures. Three-dimensional integrated circuits with irregular structures can facilitate differentiated chip design and reduce manufacturing costs. Highly complex through-silicon vias have… read more here.
Keywords: silicon vias; dimensional integrated; three dimensional; model ... See more keywords