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Published in 2023 at "Thermal Science"
DOI: 10.2298/tsci220805061r
Abstract: Considering the manufacturing and packaging process, three-dimensional integrated circuits design often requires irregular chip structures. Three-dimensional integrated circuits with irregular structures can facilitate differentiated chip design and reduce manufacturing costs. Highly complex through-silicon vias have…
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Keywords:
silicon vias;
dimensional integrated;
three dimensional;
model ... See more keywords