Integration of a Clamp Double Submodule Based on Integrated Chips for MMC Reliability Improvement
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2024.3380904
Abstract: Among different modular multilevel converters (MMCs) submodules (SMs), the clamp double submodule (CDSM) has the capability of dc-fault current clearing with a relatively small number of switching devices. Furthermore, the control scheme of CDSM-MMC is… read more here.
Keywords: based integrated; integrated chips; cdsm; clamp double ... See more keywords