Cobalt interconnect integration: progress in metal deposition, chemical mechanical polishing, and post-CMP cleaning for advanced technology nodes
Sign Up to like & getrecommendations! Published in 2025 at "Journal of Materials Chemistry C"
DOI: 10.1039/d5tc02573g
Abstract: This review systematically analyzes the deposition, chemical mechanical planarization (CMP), and post-CMP cleaning (PCMPC) processes for cobalt interconnect structures in advanced technology nodes of integrated circuits. read more here.
Keywords: cmp; chemical mechanical; cmp cleaning; post cmp ... See more keywords