Practical CMUT Fabrication With a Nitride-to-Oxide-Based Wafer Bonding Process
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DOI: 10.1109/jmems.2017.2675987
Abstract: The introduction of wafer-bonding technique to capacitive micromachined ultrasonic transducer (CMUT) fabrication offered advantages over the surface micromachining technique, such as simplified fabrication, better membrane uniformity, and increased active area. The conventional wafer-bonding CMUT process… read more here.
Keywords: wafer bonding; cmut fabrication; fabrication; bonding process ... See more keywords