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Published in 2019 at "IEEE Electron Device Letters"
DOI: 10.1109/led.2019.2940869
Abstract: We investigate the performance and reliability characteristics of Cu interconnects with Ta-based barrier layers and Co wetting layers at 7nm node dimensions with a focus on the impacts of reducing the Co thickness from 30Å…
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Keywords:
thickness advanced;
limits cobalt;
cobalt liner;
exploring limits ... See more keywords