In Situ Diagnosis of Multichip IGBT Module Wire Bonding Faults Based on Collector Voltage Undershoot
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DOI: 10.1109/tie.2022.3172768
Abstract: Condition monitoring of insulated gate bipolar transistor (IGBT) modules is an effective way to improve the transient performance and reliability of modular multilevel converters (MMC). This article proposes a novel bond wire failure monitoring method… read more here.
Keywords: voltage; igbt; multichip igbt; wire ... See more keywords