Solder Immersion Process of Ceramic Column Grid Array Package Assembly for Space Applications
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DOI: 10.1109/tcpmt.2019.2961424
Abstract: Ceramic column grid array (CCGA) packages are progressively being utilized for logic and microprocessor functionalities requiring very high-density interconnections. These packages offer various advantages, such as high reliability, good thermal and electrical performance, and reduced… read more here.
Keywords: column grid; process; solder; grid array ... See more keywords