Pressure-Compensated Chip Attach: A Low-Stress Silicon Bump Reflow Process
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DOI: 10.1109/tcpmt.2017.2684092
Abstract: Assembly of silicon onto FR4-based organic substrates using flip-chip process continues to pose substantial thermomechanical challenges largely due to the disparate coefficients of thermal expansion (CTEs) of silicon and substrate. In flip-chip packaging, this CTE… read more here.
Keywords: chip attach; pressure compensated; process; compensated chip ... See more keywords