Well‐Controlled Decomposition of Copper Complex Inks Enabled by Metal Nanowire Networks for Highly Compact, Conductive, and Flexible Copper Films
Sign Up to like & getrecommendations! Published in 2019 at "Advanced Materials Interfaces"
DOI: 10.1002/admi.201901550
Abstract: Highly compact and conductive Cu films are successfully fabricated by introducing mechanically robust and highly conductive metal nanowires (NWs) as fillers and optimizing amine‐based ligands in Cu complex inks. The metal NWs (AgNWs and CuNWs)… read more here.
Keywords: decomposition; copper; highly compact; compact conductive ... See more keywords
Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C.
Sign Up to like & getrecommendations! Published in 2018 at "Nanoscale"
DOI: 10.1039/c7nr09225c
Abstract: Cu-Ag complex inks are developed for printing conductive tracks of low cost, high stability, and high conductivity on heat-sensitive substrates such as polyethylene terephthalate (PET) substrates. The inks show an obvious self-catalyzed characteristic due to… read more here.
Keywords: copper silver; tracks low; temperature; complex inks ... See more keywords