Simulation and Experimental Verification of Moisture Diffusion in Embedded Component Packages
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DOI: 10.1109/tcpmt.2024.3396996
Abstract: This study investigated moisture diffusion and moisture concentration distribution in embedded component packages (ECPs). Three polymeric materials, such as Ajinomoto buildup film (ABF), polyimide (PI), and bismaleimide triazine (BT), used commonly in epoxy molding compound… read more here.
Keywords: moisture; moisture diffusion; embedded component; component packages ... See more keywords