Size‐Scalable and High‐Density Liquid‐Metal‐Based Soft Electronic Passive Components and Circuits Using Soft Lithography
Sign Up to like & getrecommendations! Published in 2017 at "Advanced Functional Materials"
DOI: 10.1002/adfm.201604466
Abstract: The use of conducting liquids with high electrical conductivity, such as eutectic gallium–indium (EGaIn), has great potential in electronics applications requiring stretchability and deformability beyond conventional flexible electronics relying on solid conductors. An advanced liquid… read more here.
Keywords: liquid metal; components circuits; based soft; soft lithography ... See more keywords