Study on the Tensile Creep Behavior of Carbon Nanotubes-Reinforced Sn-58Bi Solder Joints
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-017-5741-0
Abstract: The microstructure and tensile creep behavior of plain Sn-58Bi solder and carbon nanotubes (CNTs)-reinforced composite solder joints were investigated. The stress exponent n under different stresses and the creep activation energy Qc under different temperatures… read more here.
Keywords: creep behavior; composite solder; solder joints; tensile creep ... See more keywords
Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn–5Sb solder composites on Cu substrate
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2019.151714
Abstract: Abstract In this study, the effect of multi-walled carbon nanotubes (MWCNTs) reinforcement on the intermetallic compound (IMC) layer growth and shear strength of Sn–5Sb-xCNT/Cu composite solder joints subjected to different isothermal aging conditions has been… read more here.
Keywords: growth; isothermal aging; solder; imc layer ... See more keywords
Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition
Sign Up to like & getrecommendations! Published in 2024 at "Scientific Reports"
DOI: 10.1038/s41598-024-83905-3
Abstract: The effect of carbon fibers (Cf) and Ni nanoparticles addition on the melting point, microstructure, shear strength, indentation hardness and indentation creep of SnBi58/Cu solder joints were explored. Composite solder with various Cf percentages (0,… read more here.
Keywords: indentation; carbon; addition; solder ... See more keywords
Microstructure, interfacial IMC layer and mechanical properties of Cu/Sn-9Zn-xZrC/Cu solder joints
Sign Up to like & getrecommendations! Published in 2018 at "Materials Research Express"
DOI: 10.1088/2053-1591/aacd97
Abstract: The effect of trace ZrC on the wettability, microstructure and mechanical properties of Sn-9Zn composite solder alloy joints was investigated. The results indicated that the wettability of the Sn-9Zn based composite solder alloy was improved… read more here.
Keywords: composite solder; solder joints; imc layer; mechanical properties ... See more keywords
Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Nanomaterials"
DOI: 10.1155/2020/8843166
Abstract: With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the… read more here.
Keywords: lead free; composite solder; based lead; solder ... See more keywords
Molecular Dynamics Study on the Sintering Mechanism and Tensile Properties of Novel Cu Nanoparticle/Graphene Nanoplatelet Composite Solder Paste
Sign Up to like & getrecommendations! Published in 2024 at "Materials"
DOI: 10.3390/ma17194759
Abstract: The sintering process of Cu nanoparticle (Cu NP)/graphene nanoplatelet (GNP) composite solder paste was thoroughly investigated in this work through molecular dynamics simulations. The tensile properties of the sintered Cu NP/GNP composite solder paste were… read more here.
Keywords: solder paste; composite solder; molecular dynamics; tensile properties ... See more keywords
Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint
Sign Up to like & getrecommendations! Published in 2024 at "Metals"
DOI: 10.3390/met14121420
Abstract: A Sn58Bi composite solder reinforced by Ni nanoparticles was prepared using a mechanical mixing technique, and the thermomigration microstructure and properties of the solder joints were studied. The findings indicate that incorporating an appropriate quantity… read more here.
Keywords: sn58bi composite; solder joint; solder; thermomigration microstructure ... See more keywords