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Published in 2017 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-017-5741-0
Abstract: The microstructure and tensile creep behavior of plain Sn-58Bi solder and carbon nanotubes (CNTs)-reinforced composite solder joints were investigated. The stress exponent n under different stresses and the creep activation energy Qc under different temperatures…
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Keywords:
creep behavior;
composite solder;
solder joints;
tensile creep ... See more keywords
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Published in 2019 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2019.151714
Abstract: Abstract In this study, the effect of multi-walled carbon nanotubes (MWCNTs) reinforcement on the intermetallic compound (IMC) layer growth and shear strength of Sn–5Sb-xCNT/Cu composite solder joints subjected to different isothermal aging conditions has been…
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Keywords:
growth;
isothermal aging;
solder;
imc layer ... See more keywords
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Published in 2018 at "Materials Research Express"
DOI: 10.1088/2053-1591/aacd97
Abstract: The effect of trace ZrC on the wettability, microstructure and mechanical properties of Sn-9Zn composite solder alloy joints was investigated. The results indicated that the wettability of the Sn-9Zn based composite solder alloy was improved…
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Keywords:
composite solder;
solder joints;
imc layer;
mechanical properties ... See more keywords
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Published in 2020 at "Journal of Nanomaterials"
DOI: 10.1155/2020/8843166
Abstract: With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the…
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Keywords:
lead free;
composite solder;
based lead;
solder ... See more keywords