Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-8096-7
Abstract: Micron level Cu-pillar microbumps, which appear as the size of three-dimensional packaging shrinks down, have to introduce many unexpected reliability problems. The fast growth of intermetallic compounds (IMC) and voids tend to be a serious… read more here.
Keywords: voids growth; intermetallic compound; investigation intermetallic; growth fine ... See more keywords
Compound Voids and Unproductive Entrepreneurship: The Rise of the “English Fever” in China
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Economic Issues"
DOI: 10.1080/00213624.2017.1287506
Abstract: Abstract: China has emerged as an economic power due, in part, to government policies that opened China to the world and created a modern consumer culture. One of these policies is the advancement of English-language… read more here.
Keywords: compound voids; unproductive entrepreneurship; china; english fever ... See more keywords