Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper
Sign Up to like & getrecommendations! Published in 2018 at "ChemistryOpen"
DOI: 10.1002/open.201800131
Abstract: Abstract Bidentate diamine and amino‐alcohol ligands have been used to form solid, water‐soluble, and air‐stable monomeric copper complexes of the type [Cu(NH2CH2CH(R)Y)2(NO3)2] (1, R=H, Y=NH2; 2, R=H, Y=OH; 3, R=Me, Y=OH). The complexes were characterized… read more here.
Keywords: enhanced sintering; temperature; copper; conductive copper ... See more keywords
Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
Sign Up to like & getrecommendations! Published in 2017 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2016.09.152
Abstract: Abstract A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and… read more here.
Keywords: copper; copper patterns; electroless plating; conductive copper ... See more keywords
Highly conductive copper films prepared by multilayer sintering of nanoparticles synthesized via arc discharge
Sign Up to like & getrecommendations! Published in 2023 at "Nanotechnology"
DOI: 10.1088/1361-6528/acbd1f
Abstract: The major challenges in producing highly electrically conductive copper films are the oxide content and the porosity of the sintered films. This study developed a multilayer sintering method to remove the copper oxides and reduce… read more here.
Keywords: copper; multilayer sintering; copper films; arc discharge ... See more keywords