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Published in 2022 at "Materials horizons"
DOI: 10.1039/d2mh00276k
Abstract: The dramatic miniaturization and integration of electronic devices call for next-generation thermally conductive interface materials with higher service performance and long-term stability. In addition to enhancing the inherent thermal conductivity of materials, it is noteworthy…
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Keywords:
surface adhesion;
adhesion;
conductive interface;
interface ... See more keywords