A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction.
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DOI: 10.1039/d2mh00276k
Abstract: The dramatic miniaturization and integration of electronic devices call for next-generation thermally conductive interface materials with higher service performance and long-term stability. In addition to enhancing the inherent thermal conductivity of materials, it is noteworthy… read more here.
Keywords: surface adhesion; adhesion; conductive interface; interface ... See more keywords