Effects of packing powder on densification and properties of pressureless sintered silicon nitride ceramics
Sign Up to like & getrecommendations! Published in 2025 at "International Journal of Applied Ceramic Technology"
DOI: 10.1111/ijac.70001
Abstract: Pressureless sintering of Si3N4 doped with 2 mol% Y2O3 and 5 mol% MgO was carried out at temperatures ranging from 1700°C to 1770°C in three kinds of packing powders consisting of Si3N4 and BN coupled with or… read more here.
Keywords: packing powder; thermal conductivity; powder; densification ... See more keywords
Effect of Ambient Plasma Treatments on Thermal Conductivity and Fracture Toughness of Boron Nitride Nanosheets/Epoxy Nanocomposites
Sign Up to like & getrecommendations! Published in 2022 at "Nanomaterials"
DOI: 10.3390/nano13010138
Abstract: With the rapid growth in the miniaturization and integration of modern electronics, the dissipation of heat that would otherwise degrade the device efficiency and lifetime is a continuing challenge. In this respect, boron nitride nanosheets… read more here.
Keywords: thermal conductivity; ambient plasma; epoxy nanocomposites; conductivity fracture ... See more keywords