Coordination of Ultralow Permittivity and Higher Thermal Conductivity of Polyimide Induced by Unique Interfacial SelfâAssembly Behavior
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DOI: 10.1002/adfm.202417843
Abstract: Upgrading the available dielectric materials is the most effective approach to solve the poor quality of signal transmission and heat buildup caused by high density integration. In this work, a design strategy for multilayer 3D… read more here.
Keywords: ultralow permittivity; permittivity; self assembly; thermal conductivity ... See more keywords