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Published in 2021 at "IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"
DOI: 10.1109/tcad.2020.3038338
Abstract: The fully connected 3D-NoCs in which all routers are vertically connected with their neighbors above and below need a lot of Through-Silicon-Vias (TSVs), and they will occupy a large silicon area and reduce the fabrication…
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Keywords:
assignment;
connected nocs;
elevator;
placement ... See more keywords