Connectivity-Agnostic Built-In Self-Repair of Interconnects in a Chiplet IC
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DOI: 10.1109/tcad.2024.3524473
Abstract: In a chiplet IC, several dice are integrated through die-to-die interconnects. Technical challenges still exist for the repair of these die-to-die interconnects to boost the overall manufacturing yield. In this work, we propose a novel… read more here.
Keywords: die; repair; connectivity agnostic; agnostic built ... See more keywords