Thin uniform nickel seed layer formation and its impact on Ni-Cu contact adhesion for c-Si solar cell applications
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DOI: 10.1016/j.solener.2017.06.002
Abstract: Abstract Poor contact adhesion is one of the major concerns in the low cost Ni-Cu front contact metallization for c-Si solar cells. It reduces the mechanical as well as electrical reliability of the solar cell.… read more here.
Keywords: contact adhesion; seed layer; seed;