Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
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DOI: 10.1016/j.jallcom.2021.161852
Abstract: Abstract Solid-liquid interdiffusion (SLID) bonding is one of the most promising novel methods for micro-(opto)-electromechanical system (MEMS/MOEMS) wafer-level packaging. However, the current SLID bonding solutions require the use of an electrochemical deposition method for MEMS/MOEMS… read more here.
Keywords: electroplated silicon; contact electroplated; evolution; liquid interdiffusion ... See more keywords