Contact etch process optimization for RF process wafer edge yield improvement
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DOI: 10.1088/1674-4926/40/12/122402
Abstract: Radio-frequency (RF) process products suffer from a wafer edge low yield issue, which is induced by contact opening. A failure mechanism has been proposed that is based on the characteristics of a wafer edge film… read more here.
Keywords: wafer edge; process; yield; contact etch ... See more keywords