Modeling and Analysis of a New Pressure Contact Package for High-Current Large-Die IGBTs
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2019.2921012
Abstract: Megawatt-class power converters need insulated gate bipolar transistors (IGBTs) with kiloampere current ratings. Conventional IGBT power modules face difficulty to meet the reliability and over-current requirements due to bond wires, solder joint, and single-side cooling… read more here.
Keywords: contact package; pressure contact; die; package ... See more keywords