Active Thermal Control of GaN-Based DC/DC Converter
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DOI: 10.1109/tia.2018.2809543
Abstract: The new packaging technologies used for gallium nitride (GaN) devices avoid wire bonds and leads in order to completely utilize their switching performance. This also means that thermomechanical fatigue that used to exist within the… read more here.
Keywords: thermal control; gan based; control; active thermal ... See more keywords